Hot melt adhesive for packaging, specially used for intelligent wearable electronic assembly, fixation, bonding and other applications, heating and melting the coated substrate,
With the help of the reaction and chain extension of moisture in the air, the polymer with high adhesion is generated, and the adhesion, heat resistance and low temperature resistance are significantly improved.
It is widely used for plastic lamination, general assembly, splicing of wood products and bonding of paper products and plastic products,
It is especially suitable for bonding transparent boxes and their products.
| Product model | Appearance | Viscosity | Peel strength (N/mm) | Tensile strength | Elongation at break | Heat resistance | Recommended temperature |
| (cps @ 130 ℃) | PET-PET | (Kgf @ 25px2) | (%) | (? C) | (? C) |
| FH 0411 | Transparent solid | 7.5-9.5 k | ≥ 10 | ≥ 7.5 | ≥ 700 | ≥ 100 | 120-130 |
| FH 0421 | Transparent solid | 14-17k | ≥ 15 | ≥ 8.5 | ≥ 750 | ≥ 100
| 130-140 |