The hot melt adhesive for intelligent wearable electronic assembly is specially used for intelligent wearable electronic assembly, fixation, bonding and other applications, heating and melting the coating substrate,
With the help of the reaction and chain extension of moisture in the air, the polymer with high adhesion is generated, and the adhesion, heat resistance and low temperature resistance are significantly improved,
Especially suitable for bonding ink glass and aluminum alloy.
Low melting viscosity, good flow leveling, high initial bonding strength, easy to operate small and special-shaped wearable electronics,
It is mainly used for the assembly of screens, structural parts, parts, etc. of intelligent wearable electronic related products.
| Product model | Appearance | Viscosity | Shear strength @ 10min | Shear strength @ 24h |
| (cps @ 110 ° C) | (MPa) | (MPa) |
| FH 0563 | Milky solid | 2000-4000 | ≥ 1.0 | ≥ 10.0 |
| FH 0565 | Milky solid | 3000-5000 | ≥ 1.0
| ≥ 8.5 |
