With the continuous growth of the domestic economy, the continuous increase of the output of electronic products, the global industrial transfer of electronic adhesive products, and the development and popularization of smart phones, smart wearable devices and other electronic products, the application requirements of electronic glue in this field are also getting higher and higher.

In recent years, smart phones are developing towards integration, unscrewing and borderless. Many traditional adhesive materials have been unable to meet the development requirements of modern intelligent devices. PUR hot-melt adhesive emerged as a new generation of electronic adhesive due to its excellent performance.

PUR hot melt adhesive belongs to reactive polyurethane hot melt adhesive. Compared with other electronic glues, this type of product has a wide range of applicable materials, high bonding strength and good flexibility, which can meet the bonding requirements of most electronic products; This type of product has good fluidity when heated, which is convenient for dispensing/coating, and the glue form is easier to control, giving more process possibilities; Through the formula design, PUR hot-melt adhesive can meet the requirements of repairing a variety of materials, without residue and pollution, and significantly reduce the customer's bad cost.

As a reactive hot-melt structural adhesive, PUR hot-melt adhesive has the advantages of strong initial adhesion and fast positioning speed of ordinary hot-melt adhesive, as well as water resistance, heat resistance, cold resistance, creep resistance and medium resistance of reactive adhesive. In addition, this kind of product has 100% solid content, does not contain water or other solvents, meets the environmental requirements of Reach, RoHS2.0, etc., and is a high-performance environmental adhesive.