Performance characteristics of PUR hot melt adhesive

1. Single component, solvent free;

2. With 100% solid content, it is easier to control the thickness of glue, so it can meet the design requirements of current narrow frame mobile phones;

3. Its adhesiveness and toughness are adjustable, and it has excellent adhesive strength;

4. Good temperature resistance, chemical corrosion resistance and aging resistance, which can meet the requirements of waterproof, dust-proof and high and low temperature resistance;

5. Because of its high reactivity, it shows excellent adhesion to a variety of materials.

With the integration of smart phones, tablets, smart wear and other electronic devices, the development of screwless and borderless, many traditional adhesives have been unable to meet the design and use requirements of modern intelligent devices. PUR hot melt adhesive is a new type of adhesive for electronic products developed in response to the requirements of intelligent electronic development. PUR hot melt adhesive has high bonding strength, no organic solvent, and is green; At the same time, it can realize automatic operation and improve production efficiency. It has broad prospects in structural bonding of mobile electronic equipment, and will produce huge economic value and social value in this field.